Insignis' proprietary, extended test flow is engineered to produce premium quality products through our longer burn times, wider temperature ranges, and highly advanced lot, wafer, and die selection criteria.

The Insignis proprietary test flow guarantees the operation of our devices at elevated junction temperatures of a minimum of 105’C through enhanced testing at multiple steps. Our burn flow is designed to stress the product at junction temperatures reaching 140°C. This removes any early life fails along with all die that have junction temperature-related fail modes.

The Insignis packaged product test flow is also engineered to guarantee the specifications are met at a 105°C junction temperature. We do this through the application of external heat on the devices such that the junction temperatures exceed 105°C during speed and margin testing.