Die Selection

Insignis flow selects only the die from the high quality portion of each graph.  Those die are shown as the green boxes on the wafer map.


The standard BURN process targets a FIT (Failure In Time) rate for a population of parts.  The standard product runs BURN to just meet that FIT target.  The Insignis quality material runs an extended BURN time to further improve the population to give an even better FIT rate.  Longer BURN times translate into a better quality and reliability experience for Insignis customers.

Guardband Testing

More guardband = Higher quality and reliability

Testing guardband builds in quality and margin into the product.  The Insignis flow runs wider temperature guardbands as compared to the standard flow.  The Insignis test flow also runs wider voltage and specification guardbands at every step to build in more quality into every die.  These more stringent test conditions improve the overall quality and reliability of the population as compared to the standard test flows.


Insignis' proprietary, enhanced test flow is engineered to produce premium quality parts through our longer burn times, wider temperature ranges, and highly advanced lot, wafer, and die selection criteria.

Our ability to mitigate Early Life Failures allows our customers to avoid the risk of defects associated with standard grade memory.


For additional information about our Extended Test Flow, click here.